PROCESSOR UNIT WITH ACTIVE COOLING SYSTEM FOR PROCESSOR DEVICE
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jun 22, 2023
filing date -
Jun 22, 2023
priority date (Note) -
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Abstract
A processor unit includes a cooling unit for dedicated cooling of a processor device that includes at least one processor. The cooling unit includes a pumped liquid loop that circulates a working fluid to remove heat from the processor device, and to transmit that heat to a passive radiator thermally coupled to the liquid loop, to radiate the heat to an external environment. The cooling unit may be used in conjunction with additional cooling of a board, such as a printed wiring board, to which the processor device is operatively and thermally coupled. The cooling unit may be part of a spacecraft, and may enable use of high-powered processing devices as part of such spacecraft.
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