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Abstract

Provided are a surface mounting type electronic component mounting module using a bus bar, wherein the heights of solder mounting surfaces of a laminated bus bar of an anode and a laminated bus bar of a cathode are aligned to enable the use of reflow solder, and a more space-saving and miniaturized electronic component mounting module without lowering electrical characteristics. An electronic component mounting module is provided with a bus bar laminate in which a first bus bar and a second bus bar, each of which is provided with a region for soldering an external terminal of an electronic component, are laminated in an insulated manner, wherein the first bus bar is provided with an opening, the second bus bar is provided with a convex body projecting toward the first bus bar side and including a region for soldering, the convex body of the second bus bar is arranged at a position corresponding to the opening, the region for soldering the first bus bar and the region for soldering the convex body are set to have the same height as to such an extent that an external terminal of the electronic component by reflow soldering can be soldered, a plurality of electronic components to which the external terminals are soldered are provided on the first bus bar side, and the plurality of electronic components are connected to one convex body by external terminals of the same polarity.

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First Claim