SEMICONDUCTOR PROCESSING PRECLEAN METHODS AND APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240429038A1
SERIAL NO

18827621

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Abstract

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In some embodiments, a method for semiconductor processing preclean includes removing an oxide layer from a substrate using anhydrous hydrogen fluoride in combination with water vapor. A system for the preclean may be configured to separate the anhydrous hydrogen fluoride and the water vapor until they are delivered to a common volume near the substrate. Corrosion within components of the system may be limited by purification of anhydrous hydrogen fluoride, passivation of components, changing component materials, and heating components. Passivation may be achieved by filling a gas delivery component with anhydrous hydrogen fluoride and allowing the anhydrous hydrogen fluoride to remain in the gas delivery component to form a passivation layer. Consistent water vapor delivery may be achieved in part by heating components using heaters.

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Patent Owner(s)

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ASM IP HOLDING B V1322 AP ALMERE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Azimi, Amin Phoenix, US 4 1
Chaudhury, Aditya Tempe, US 2 1
Fu, Yen Chun Tempe, US 3 1
Jin, Qu Chandler, US 5 18
Jotheeswaran, Bubesh Babu Gilbert, US 8 716
Kosireddy, Rajeev Reddy Tempe, US 3 1
Kulkarni, Prahlad Tempe, US 2 1
Lin, Xing Chandler, US 79 3508
Shin, Woo Jung Chandler, US 11 254
Sun, Xiaoda Temple, US 3 4
Walimbe, Aditya Tempe, US 5 258
Wang, Fei Portland, US 1116 10607
Wei, Chuang Chandler, US 12 646

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