PRINTED WIRING BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jul 28, 2022
filing date -
Jul 28, 2022
priority date (Note) -
Published
status (Latency Note)
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Abstract
The printed wiring board according to an embodiment of the present disclosure comprises: a substrate; a first wiring layer having a first wiring that is disposed directly or indirectly on the substrate; and a second wiring layer having a second wiring that is disposed directly or indirectly on the substrate. The average wire width of the first wiring is 40 μm or less, and the average wire width of the second wiring is 50 μm or more.
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