Importance

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Abstract

A printed wiring board includes a first insulating layer, a connection conductor layer including wiring, a second insulating layer covering the connection conductor layer, a conductor layer including first and second electrodes such that the first electrode mounts a first electronic component and the second electrode mounts a second electronic component, and via conductors including first and second via conductors. The first via conductor connects the first electrode and wiring. The second via conductor connects the second electrode and wiring. The conductor layer includes a seed layer and an electrolytic plating layer. The seed layer includes a first layer formed on the first insulating layer and a second layer formed on the first layer, a width of the first layer is larger than a width of the second layer, and a width of the electrolytic plating layer is larger than the width of the first layer of the seed layer.

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First Claim