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Abstract

A method of manufacturing a printed circuit board having a metallic conductor structure that includes providing a base substrate in a film or sheet having a first substrate side and a second substrate side, which consists at least partly of an electrically non-conductive organic polymer material, covering the first substrate side with a resist, partially removing the resist, so that the first substrate side is divided into at least a first sub-area, in which the first substrate side is still covered with the resist, and into at least a second sub-area, in which the first substrate side is free of the resist, after partial removal of the resist in the at least one second sub-area, applying a plasma to the first substrate side such that the polymer material in the at least one second sub-area is removed, and thereby forming at least one elongate, channel-like recess, applying a metallization to the first substrate side, and planarizing the first substrate side, optionally with removal of the metallization in the first sub-area, and with retention of the formed at least one elongate, channel-like recess, wherein the resist is a photoresist or a resist made of a laser-removable polymer material, the resist in the first sub-area is completely or at least almost completely removed by the plasma treatment, and the resist is applied to the first substrate side in a thickness that ensures that a desired depth of the elongate channel-like recess is achieved before significant ablation of the first substrate side by the plasma in the first sub-area occurs.

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First Claim