PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFACE OF THE PRINTED CIRCUIT BOARD FOR THE COB IC CARD
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jun 17, 2024
filing date -
Jun 17, 2024
priority date (Note) -
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Abstract
A method of treating a surface of a printed circuit board (PCB) for a chip on board (COB) integrated circuit (IC) card includes generating a flexible copper foil laminated film by laminating copper foils on opposite sides of an insulating layer, forming a circuit pattern layer on opposite sides of the flexible copper foil laminated film, laminating nickel through electroplating on the opposite sides of the flexible copper foil laminated film having formed thereon the circuit pattern layer, and electroplating a copper-tin (CuSn) compound layer on a contact side on which the flexible copper foil laminated film having electroplated thereon nickel is exposed to outside.
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