A METHOD AND A SYSTEM FOR ENCAPSULATING A COMPONENT ARRANGED ON A SUBSTRATE
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
May 24, 2024
filing date -
May 24, 2024
priority date (Note) -
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Abstract
Disclosed is a method of at least partly encapsulating at least one component arranged on a substrate. The method comprises the step of dispensing at least one drop of a polymer on and/or around the component by jetting, using a nozzle, to obtain a dispensed polymer. The method further comprises at least partly curing the dispensed polymer by exposing the dispensed polymer to a light source to obtain a cured polymer. The method further comprises protecting the nozzle while at least partly curing the dispensed polymer, and repeating the steps of dispensing, at least partly curing and protecting, thereby at least partly encapsulating the component.
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