SUBSTRATE PROCESSING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250010330A1
SERIAL NO

18711588

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Abstract

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In this substrate processing method, a water-repellent treatment is performed on a upper surface of a substrate so as to change the contact angle of pure water with respect to a flat surface to 90° or greater, and then a hydrophobic liquid is supplied to the upper surface of the substrate, thereby replacing a water repellent agent-containing liquid on the upper surface of the substrate with the hydrophobic liquid. After the hydrophobic liquid replacement step, a hydrophilic liquid is supplied to the upper surface of the substrate, thereby replacing the hydrophobic liquid on the upper surface of the substrate with the hydrophilic liquid. After the hydrophilic liquid replacement step, the hydrophilic liquid on the upper surface of the substrate is caused to flow and is removed from the upper surface of the substrate, and the upper surface of the substrate is thereby dried.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDTENJINKITA-MACHI 1-1 TERANOUCHI-AGARU 4-CHOME HORIKAWA-DORI KAMIGYO-KU KYOTO-SHI KYOTO 602-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
OTSUJI, Masayuki Kyoto, JP 38 117
TANAKA, Takayoshi Kyoto, JP 57 306

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