ALKOXYSILANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM
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United States of America
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Jan 9, 2025
app pub date -
Oct 11, 2022
filing date -
Oct 11, 2022
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Abstract
A method for making a dense organosilicon film with improved mechanical properties includes the steps of: providing a substrate within a reaction chamber; introducing into the reaction chamber a gaseous composition comprising alkoxy silane; and applying energy to the gaseous composition comprising alkoxysilane in the reaction chamber to induce reaction of the gaseous composition comprising alkoxysilane to deposit an organosilicon film on the substrate, wherein the organosilicon film has a dielectric constant of from ˜2.40 to ˜3.20, an elastic modulus of from ˜6 to ˜30 GPa, and an at. % carbon of from ˜10 to ˜45 as measured by XPS.
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