SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250010341A1
SERIAL NO

18761581

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus includes a processor configured to process a substrate with a processing liquid. The processor has a holder configured to hold the substrate horizontally. The holder includes a first holder configured to come into contact with a center of a bottom surface of the substrate. The processor has a rotation driver configured to rotate the first holder around a vertical rotation axis. The substrate processing apparatus includes a charging member configured to charge a second substrate prepared separately from the substrate; and a controller configured to perform bringing the second substrate charged by the charging member into contact with the first holder.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kurusu, Kento Koshi City, JP 10 42
Obaru, Takanori Koshi City, JP 8 10

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