POLISHING APPARATUS AND POLISHING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250010428A1
SERIAL NO

18732570

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The disclosure provides a polishing apparatus capable of removing a polishing liquid or polishing debris from a light passing portion of a polishing pad. A polishing apparatus 1 includes a polishing table 3 supporting a polishing pad 2 that has a light passing portion 33; a polishing head 5 pressing a substrate W against a polishing surface 2a of the polishing pad 2; an optical sensor 21 disposed in the polishing table 3, irradiating light to the substrate W through the light passing portion 33, and receiving reflected light from the substrate W through the light passing portion 33; and a cleaning portion 12 forming a cleaning space CS that covers the light passing portion 33 above the light passing portion 33 and supplying a cleaning fluid to the light passing portion 33 through the cleaning space CS.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KULKARNI, SAURABH Tokyo, JP 5 15

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