LOW-PARTICLE GAS ENCLOSURE SYSTEMS AND METHODS
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Jul 10, 2024
filing date -
Jul 10, 2024
priority date (Note) -
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Abstract
A method comprises processing a substrate in a gas enclosure to form a film on one or more portions of the substrate. The method further comprises, while processing the substrate, circulating gas along a circulation path through the gas enclosure. Circulating the gas may comprise flowing gas through an exhaust housing enclosing a printhead assembly housed in the gas enclosure and filtering the gas flowing downstream of the printhead assembly from the exhaust housing.
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