FOAM INSULATION DOUGH
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Jan 9, 2025
app pub date -
Jul 2, 2024
filing date -
Jul 2, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A moldable thermal insulation composite is provided. The composite includes a thermoset polymer, a curing agent, a thermal conductivity filler, and a physical blowing agent. The thermal conductivity filler includes a hollow-interior glass sphere (HGS) or porous-shell hollow-interior glass sphere (PHGS). The physical blowing agent includes an expandable thermoplastic microsphere (EMS). The thermal conductivity filler is present in the composite in an amount of 0.1 to 49.9 wt. %. The physical blowing agent is present in the composite in an amount of 0.1 to 49.9 wt. %. The thermal conductivity filler and the physical blowing agent are present in the composite in a combined amount of 20 to 50 wt. %. A method of manufacturing a thermal insulation composite is also provided.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully