ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING ROUGHENED COPPER FOIL
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United States of America
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Jan 9, 2025
app pub date -
Nov 15, 2022
filing date -
Nov 15, 2022
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Abstract
Provided is an aqueous composition for roughening the surface of a rolled copper foil. The aqueous composition contains hydrogen peroxide, sulfuric acid, and an azole compound and/or a salt thereof. Based on the total mass of the aqueous composition, the content of hydrogen peroxide is 0.1 to 5% by mass, the content of sulfuric acid is 0.5 to 15% by mass, and the content of the azole compound is 0.01 to 0.3% by mass. The molar ratio of hydrogen peroxide to sulfuric acid is in the range of 0.1 to 1.0. The azole compound is a benzotriazole compound and/or a tetrazole compound. Also provided are a method for roughening a copper foil using the aqueous composition, a method for producing a roughened copper foil using the aqueous composition, a roughened copper foil, and a flexible printed circuit board using the roughened copper foil.
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