INDUCTIVE COMPONENT, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250014814A1
SERIAL NO

18546966

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Abstract

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Disclosed are an inductive component and a preparation method therefor and an application thereof. The preparation method comprises the following steps: (1) mixing and granulating a first magnetic alloy powder, a second magnetic alloy powder, and a binder, and then performing pressing, and baking and curing the pressed blank to obtain a magnetic central core; (2) combining the magnetic central core obtained in step (1) with a coil and placing into a mold cavity, injecting a cladding powder slurry, and then baking to obtain a semi-finished component; and (3) coating an insulation layer on the surface of the semi-finished component obtained in step (2), performing paint stripping, and then performing electroplating to form an electrode layer to obtain the inductive component. By performing the low-pressure forming process, the inductive component provided by the present application has the advantages of low basic pressure between the coil and the powder, small change of the DC impedance of the coil and small internal stress of the powder, solving the problems of high interlayer defect rate and interlayer short circuit of the products caused by serious insulation damage of the powder under high pressure in the existing process.

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Patent Owner(s)

Patent OwnerAddress
HENGDIAN GROUP DMEGC MAGNETICS CO LTDDONGYANG ZHEJIANG 322118

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Shengqi Dongyang City Jinhua, Zhejiang, CN 3 1
HU, Jianghao Dongyang City Jinhua, Zhejiang, CN 1 0
JIN, Zhanfan Dongyang City Jinhua, Zhejiang, CN 1 0
LOU, Haifei Dongyang City Jinhua, Zhejiang, CN 2 0

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