THERMAL INTERFACE MATERIAL
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Sep 20, 2024
filing date -
Sep 20, 2024
priority date (Note) -
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Abstract
A thermal interface material that conducts heat is disclosed. The thermal interface includes a bulk layer and at least one adhesive layer. The bulk layer includes a first acrylic rubber, plasticizer particles, and first filler particles, and the first filler particles are substantially aligned in a first direction. The first adhesive layer is disposed on a first side of the bulk material. The first adhesive layer has a greater tackiness than the bulk material. The first adhesive layer comprises a second acrylic rubber. The first direction is substantially perpendicular to a first surface of the first side on which the first adhesive layer is disposed.
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