PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Apr 8, 2024
filing date -
Apr 8, 2024
priority date (Note) -
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Abstract
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first insulating layer, a first metal layer disposed on an upper side of the first insulating layer, a second metal layer disposed on a lower side of the first insulating layer, and a first via layer penetrating through at least a portion of the first insulating layer to connect the first metal layer to the second metal layer. The first via layer has a tapered shape becoming narrower toward a top of the first insulating layer, and an upper surface of the first metal layer is substantially flat, and a side surface of the first metal layer has a curved surface.
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