Importance

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Abstract

A wafer processing system (1) is provided. The system (1) includes a processing tool (10) comprising at least one grinding member (16) used to remove material from a wafer substrate (80). The system (1) also includes an electrolyte supply line (361) used to supply an electrolyte to the wafer substrate (80). The system (1) further includes a holding module (20) for holding the wafer substrate (80). The holding module (20) includes a conductive base (21) and a conductive porous member (22) positioned on the top surface of the conductive base (21). A vacuum source (53) fluidly communicated with fluid channel (214) formed in the conductive base (21) to create a vacuum to hold the wafer substrate (80) on the conductive porous member (22). In addition, the system (1) includes an actuator assembly for driving a rotation of the grinding member (16) and a rotation of the conductive base (21), and a power supply module (45) to apply an electric current to the grinding member (16) and to the conductive porous member (22) through the conductive base (21).

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First Claim