THERMOSETTING RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET, HEAT-DISSIPATING LAYERED PRODUCT, HEAT-DISSIPATING CIRCUIT BOARD, SEMICONDUCTOR DEVICE AND POWER MODULE
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United States of America
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Issued Date -
Jan 16, 2025
app pub date -
Sep 20, 2024
filing date -
Sep 20, 2024
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Abstract
A thermosetting resin composition containing a thermosetting resin, an inorganic filler, and a polymer having a mass average molecular weight of 10,000 or more, wherein the thermosetting resin composition includes boron nitride agglomerated particles as the inorganic filler, and includes an epoxy compound and a benzoxazine compound as the thermosetting resin, and a ratio of a mass content of the boron nitride agglomerated particles to a mass content of the benzoxazine compound (boron nitride agglomerated particles/benzoxazine) is 5 or more and 50 or less, a thermally conductive sheet having thermal conductivity and heat resistance can be formed. In addition, the thermosetting resin composition can be formed into a film without any problem when forming a sheet, and sufficient adhesive strength can be obtained when cured.
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