THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250019497A1
SERIAL NO

18687324

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Abstract

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Provided are hydrosilylation (addition) curable thermally conductive silicone rubber compositions containing high levels (e.g., greater than 80 wt. %) of thermally conductive fillers, a method for their preparation, and cured silicone-based products made from the compositions which have a thermal conductivity of at least 1.5 W/mK whilst retaining adequate physical properties such as tensile strength and elasticity. The use of such materials is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
DOW SILICONES CORP2200 WEST SALZBURG ROAD P O BOX 994 MIDLAND MICHIGAN 48686-0994 48686-0994

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Yusheng Shanghai, CN 31 32
GUO, Yi Shanghai, CN 236 1263
WANG, Rui Shanghai, CN 821 4323
ZHANG, Zhihai Shanghai, CN 31 81
ZHENG, Yan Shanghai, CN 183 716

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