CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR PREVENTING POLISHING PAD GROOVE CLOGGING
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United States of America
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Issued Date -
Jan 16, 2025
app pub date -
Jul 12, 2023
filing date -
Jul 12, 2023
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Abstract
An aqueous based chemical mechanical polishing composition for polishing a semiconductor substrate includes an abrasive having bimodal distributed colloidal silica particles which include elongated colloidal silica particles, polyvinyl alcohol 80% hydrolyzed to less than or equal to 90% hydrolyzed, an electrolyte and a pH greater than 7, and a method of polishing the semiconductor substrate to planarize the substrate. The aqueous based chemical mechanical polishing composition and method inhibits polishing pad groove clogging during chemical mechanical polishing of the semiconductor substrates.
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