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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

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• H03H:IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONA....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Aspar, Gabrielle	Besançon, FR	1	0
Ballandras, Sylvain	Besançon, FR	53	131
Bernard, Florent	Besançon, FR	16	21
Courjon, Emilie	Franois, FR	16	6
Laroche, Thierry	Besançon, FR	22	14

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Jul 16, 2028
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 16, 2032
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 16, 2036

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
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Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2025/0023,545

SYSTEM FOR ENCAPSULATING A SURFACE ELASTIC WAVE DEVICE

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