CUTTING METHOD OF A LAYER OF CERAMIC POWDER MATERIAL, MANUFACTURING PROCESS AND MANUFACTURING PLANT OF CERAMIC ARTICLES
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Nov 30, 2022
filing date -
Nov 30, 2022
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Abstract
Cutting method of a layer(S) of ceramic powder material having a modulus of rupture that is smaller than about 10 N/mm2, comprising: a step of moving the layer(S) of ceramic powder material along a given path (P) in a moving direction (A) through a cutting station; and a cutting step, during which at least a first water-jet cutting device cuts said layer(S) of ceramic powder material along a first direction (D1) that is transverse to the moving direction (A), so as to cut said layer(S) of ceramic powder material and obtain a plurality of articles of ceramic powder material (MCP).
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