TEMPORARY SHEET BONDING METHOD AND APPARATUS
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Dec 2, 2022
filing date -
Dec 2, 2022
priority date (Note) -
Published
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Abstract
A temporary sheet bonding method includes dip-coating temporary bonding layer 200 on a first sheet 100 by dipping the first sheet into a bonding solution comprising a surfactant and temporarily bonding the second sheet 300 to the first sheet via the temporary bonding layer. The surfactant includes cetyltrimethylammonium bromide or poly [(3-methyl-1-vinylimidazolium chloride)-co-(1-vinylpyrrolidone)]. A sheet dip coating apparatus includes a bonding solution bath 410 in which a bonding solution containing a surfactant is contained, a cassette 430 into which a plurality of first sheets are to be loaded, and a driver configured to move the cassette up/down. The driver sequentially moves the cassette down to immerse the first sheet in the bonding solution, the cassette up until the plurality of first sheets are removed from the bonding solution, and the cassette up and away from a surface of the bonding solution.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
CORNING PRECISION MATERIALS CO LTD | ASAN-SI CHUNGCHEONGNAM-DO 336-841 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kong, Bokyung | Hwasung-city, KR | 10 | 1 |
Lee, JooYoung | Asan-si, KR | 70 | 288 |
Oh, Joohye | Cheonan-si, KR | 1 | 0 |
Shin, Yujin | Asan-si, KR | 6 | 0 |
Woo, Kwangje | Suwon-si, KR | 7 | 3 |
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