Wafer-Level Poling of Electro-Optic Phase Modulators

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20250028195A1
SERIAL NO

18778171

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Abstract

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A method of fabricating an integrated electro-optic phase modulator array is described. The method may include providing a first substrate. The first substrate may include an interconnect array. The method may include arranging an array of electro-optic phase modulators on a surface of the first substrate. Each electro-optic phase modulator may include a polymer optical stack, a semiconductor substrate, an electric input, an optical input, and/or an optical output. The interconnect array in each modulator may include an electrical interconnect, an electrical bypass, and/or an optical interconnect. The electrical interconnect may connect to a respective electrical input. The electrical bypass may connect at least a pair of adjacent modulators. The optical interconnect may connect a respective optical input and optical output. Each modulator may be series connected to a respective fuse arranged along the electric interconnect between the respective electric input and a voltage source.

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Patent Owner(s)

Patent OwnerAddress
LIGHTWAVE LOGIC INC369 INVERNESS PKWY SUITE 350 ENGLEWOOD CO 80112

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Drisko, Jasper Altman Portland, US 1 0

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