ADAPTIVE TEMPERATURE COMPENSATION FOR A MEMORY DEVICE
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Oct 3, 2024
filing date -
Oct 3, 2024
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Abstract
A first analysis of each respective die of a multi-die memory device is performed. An equation to determine a respective temperature compensation (tempco) value for each respective die based on a number of program erase cycles (PECs) of the respective die based on the first analysis s determined. The equation for use in processing memory access requests directed to the respective die is stored. Whether to update the equation directed to the respective die based on a second analysis of the respective die is determined.
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