SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Jan 11, 2024
filing date -
Jan 11, 2024
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Abstract
Provided is a substrate processing apparatus including a process chamber including a process space, a stage configured to support a substrate, a rotator configured to rotate the stage, a pressurizing pump configured to increase a pressure in the process space, and a cleaning agent discharger configured to spray a cleaning agent into the process space. The cleaning agent discharger includes a discharge ring including a discharge path through which the cleaning agent flows and a plurality of discharge nozzles connected to the discharge ring and spaced apart in a circumferential direction about a central axis of the stage.
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