METHOD FOR PRODUCING AN ELECTRICAL CONNECTION FOR A POWER MODULE OF AN AIRCRAFT
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Dec 1, 2022
filing date -
Dec 1, 2022
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Abstract
A process carrying out non-planar three-dimensional forming of at least one segment of a flexible printed circuit board including an electrically insulating polymer film, and, on at least one side of the polymer film, a metallization then carrying out electrodeposition in which a conductive layer is deposited on at least the metallization of at least the formed segment.
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