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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
YMT CO LTD	30 NAMDONGDONG-RO 153BEON-GIL NAMDONG-GU INCHEON 21690

International Classification(s)

• C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
• C25D:PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC ....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
AN, Jae Hak	Anyang si, KR	1	0
CHUN, Sung Wook	Incheon, KR	17	34
CHUNG, Bo Mook	Incheon, KR	11	0
KANG, Hyun Seung	Gwangmyeong-si, KR	1	0
KIM, Dea Geun	Incheon, KR	7	0
PARK, Myong Hwan	Incheon, KR	3	0
YANG, Dongmin	Incheon, KR	22	998

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Jul 23, 2028
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 23, 2032
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 23, 2036

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2025/0031,316

METHODS FOR FORMING CIRCUIT PATTERN ON SUBSTRATE USING METAL FOIL WITH LOW SURFACE ROUGHNESS

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