THERMOSETTING RESIN COMPOSITION, RESIN CURED PRODUCT AND COMPOSITE MOLDED BODY
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United States of America
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Issued Date -
Jan 30, 2025
app pub date -
Sep 27, 2024
filing date -
Sep 27, 2024
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Abstract
A thermosetting resin composition that is capable of suppressing the occurrence of gaps that form between an adherend and a sheet even when the sheet is closely adhered by pressing against an adherend having a roughened surface with a low pressing force. The thermosetting resin composition includes an epoxy resin as a main component resin and boron nitride agglomerated particles as an inorganic filler. A proportion of the boron nitride agglomerated particles in the resin composition is 40% by volume or more and 50% by volume or less, and a proportion of the inorganic filler other than the boron nitride agglomerated particles in the resin composition is 7% by volume or less.
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