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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

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International Classification(s)

• C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
• C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Ito, Takanori	Matsuida-machi, Annaka-shi, Gunma, JP	92	819

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Jul 30, 2028
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 30, 2032
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 30, 2036

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2025/0034,437

THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION AND A THERMALLY CONDUCTIVE COMPOSITE

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