COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, BUS BAR, AND LEAD FRAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250034679A1
SERIAL NO

18688197

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This copper alloy has a composition containing Mg in an amount of 0.10 mass % or greater and 2.6 mass % or less, with a balance being Cu and inevitable impurities, in which in a plastic deformation region of a stress-strain curve obtained in a low-speed tensile test at a strain rate of 1.0×10−6/s, an average value of a period of a strain of a saw edge-shaped curve is 0.01% or greater and 1.0% or less, an average value of a difference in level of stress of the saw edge-shaped curve is 0.1 MPa or greater and 2 MPa or less, and there are five or more saw edge-shaped curves with a period of strain of 0.01% or greater and 1.0% or less and a difference in the level of stress of 0.1 MPa or greater and 2 MPa or less.

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Patent Owner(s)

  • MITSUBISHI MATERIALS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUNAKI, Shinichi Aizuwakamatsu-shi, JP 14 14
INOUE, Yuki Kitamoto-shi, JP 103 646
ITO, Yuki Kitamoto-shi, JP 259 1097
KOBAYASHI, Takanori Aizuwakamatsu-shi, JP 36 317
MAKI, Kazunari Kitamoto-shi, JP 74 205

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