APPARATUS AND METHOD OF TREATING SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250034719A1
SERIAL NO

18754613

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed is an apparatus for processing a substrate, the apparatus including: a chamber for forming a processing space in which a processing process for a substrate is performed therein by a combination of a first body and a second body; and a driver for moving any one of the first body or the second body relative to the other such that a relative position between the first body and the second body is changeable between a sealed position at which the processing space is sealed from the outside and an open position at which the processing space is opened, in which the first body is formed with a first protrusion on a face that is in contact with the second body, the second body is formed with a first receiving portion, and the first protrusion is provided to be inserted into the first receiving portion when the first body and the second body are at the sealed position.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTDCHEONAN-SI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHO, Hong Chan Hwaseong-si, KR 4 0
HEO, Pil Kyun Yongin-si, KR 23 12
KANG, Ki Moon Yongin-si, KR 9 1
KIM, Byeong Kwan Hwaseong-si, KR 3 0
WON, Joon Ho Suwon-si, KR 12 161

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