Package Comprising At Least Two Contacts For Microtechnology, Method For Handling A Package, And Tool For Implementing The Method
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Jan 30, 2025
app pub date -
Jul 12, 2024
filing date -
Jul 12, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A package comprises at least two contacts for microtechnology, the contacts each having a contact surface, the contacts being connected to at least one support structure and the contacts being spaced apart from each other and disposed in such a manner that the contact surfaces are disposed in one plane and are oriented in the same direction. The support structure is made of a connective material being separable and/or destroyable by a laser. Furthermore, a method for handling such a package and a tool for implementing such a method are provided.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully