CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS AND METHOD FOR PRODUCING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Jan 30, 2025
app pub date -
Oct 31, 2023
filing date -
Oct 31, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A circuit board structure including metal materials with different thermal expansion coefficients and a method for producing the same are provided. The circuit board structure includes a core substrate layer, a first wiring layer formed on the core substrate layer, and an insulating dielectric layer formed on the first wiring layer. The insulating dielectric layer has a signal via hole formed at an inner side thereof. The circuit board structure further includes a first metal material and a second metal material formed in the signal via hole. The first metal material is formed on the first wiring layer, and the second metal material is formed on the first metal material. The first metal material has a first thermal expansion coefficient, the second metal material has a second thermal expansion coefficient, and the second thermal expansion coefficient is greater than the first thermal expansion coefficient.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully