CAPACITIVE ELEMENT, CIRCUIT CARRIER HAVING THE SAME AND FABRICATION METHOD THEREOF
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United States of America
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Issued Date -
Jan 30, 2025
app pub date -
Aug 21, 2023
filing date -
Aug 21, 2023
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Abstract
A circuit carrier includes at least one wiring layer and a capacitive element. The capacitive element is disposed in at least one dielectric layer of the wiring layer. The capacitive element includes a lower electrode, an inter-electrode and an upper electrode. The inter-electrode is located between the lower electrode and the upper electrode. The inter-electrode includes a plate, at least one first finger and at least one second finger. The first finger and the second finger extend from opposite sides of the plate, respectively.
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