SILVER POWDER, METHOD OF PRODUCING SILVER POWDER, AND CONDUCTIVE PASTE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250041936A1
SERIAL NO

18715737

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Abstract

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Provided are a silver powder that can reduce line resistance and a method of producing the same. The silver powder has a diameter at a cumulative value of 50% of 3 μm or more and a ratio of particles of 10 μm or larger of 10% or less. The silver powder includes flake-like particles having a major axis of 6 μm or more and irregularly shaped particles having a major axis of less than 6 μm, an average aspect ratio that is a ratio of average major axis relative to average thickness of the flake-like particles is 8 or more, and a shape factor that is a ratio of area of a circle having average maximum length of the irregularly shaped particles as a diameter relative to average particle area of the irregularly shaped particles is 1.7 to 1.9. Ignition loss is 0.1 wt % to 0.4 wt %.

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Patent Owner(s)

Patent OwnerAddress
DOWA ELECTRONICS MATERIALS CO LTD4-14-1 SOTOKANDA CHIYODA-KU TOKYO 1010021 ?1010021

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ABE, Fumiya Takasaki-shi, Gunma, JP 23 556
KANASUGI, Minami Kosaka-machi, Akita, JP 3 3
KOUBU, Hiroaki Honjo-shi, Saitama, JP 3 0
TORIGOE, Taro Okayama-shi, Okayama, JP 2 2

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