SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING APPARATUS
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Feb 2, 2024
filing date -
Feb 2, 2024
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Abstract
Provided are a slurry composition for chemical mechanical polishing including: an abrasive including a polishing particle and a coating layer surrounding the polishing particle; and a photoinitiator, wherein the polishing particle includes a metal oxide, and wherein the coating layer includes a photoreactive monomer or oligomer, and a chemical mechanical polishing apparatus.
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