ELECTRICALLY CONDUCTIVE BONDING TAPE AND ELECTRONIC DEVICE INCLUDING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250043159A1
SERIAL NO

18714865

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Abstract

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The disclosure relates to an electrically conductive bonding tape and an electronic device including the same. Specifically, according to an embodiment of the disclosure, there is provided an electrically conductive bonding tape, including an electrically conductive first adhesive layer including opposing first and second major surfaces and electrically conductive along at least a thickness direction, the first adhesive layer having an average thickness t and including a substantially electrically insulative first adhesive material and pluralities of electrically conductive first and second particles dispersed in the first adhesive material, the first and second particles having respective average thickness t1 and t2, t1/t being 0.7-0.95 inclusive, t2/t being 0.2-0.7 inclusive.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Jeongwan Suwon-Si, KR 23 101
Kim, Jong-Pil Gyeonggi-do, KR 38 146
Shin, Junbeom Hwaseong-si, KR 2 0

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