Capacitor Carrier Ring And Stiffener For Integrated Circuit Package Assembly
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Aug 3, 2023
filing date -
Aug 3, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic package assembly is disclosed that implements a capacitor carrier capable of providing package warpage control and that eliminates the need to only bond chip capacitors directly to a surface of the package substrate. The capacitor carrier may be composed of a material that has a high coefficient of thermal expansion and a high Young's modulus. A capacitor carrier with these characteristics can eliminate the need for a traditional stiffener in the chip package.
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