SUBSTRATE TREATING METHOD, SUBSTRATE MANUFACTURING METHOD, AND SUBSTRATE TREATING APPARATUS
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Jun 6, 2024
filing date -
Jun 6, 2024
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Abstract
Disclosed is a method of treating a substrate, the method including: a first pre-wet operation of supplying a first pre-wet liquid to a rotating substrate; a second pre-wet operation of supplying a second pre-wet liquid having a temperature different from the first pre-wet liquid to the rotating substrate, the second pre-wet operation being performed after the first pre-wet operation; and a chemical treatment operation of supplying a chemical that is a liquid of a different type from the first pre-wet liquid and the second pre-wet liquid to the rotating substrate, the chemical treatment operation being performed after the second pre-wet operation.
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