Importance

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Abstract

A metal-ceramic substrate (1) provided as a printed circuit board for attaching electrical components, comprising

a component metallization (10) and a backside metallization (20), anda ceramic element (30) arranged along a stacking direction (S) between the component metallization (10) and the backside metallization (20),wherein the component metallization (10) comprises a first metal section (11) and a second metal section (12), the first metal section (11) and the second metal section (12) being separated from each other by an isolation section (15), andwherein the backside metallization (20) has a material weakening (25), in particular a material recess, which is arranged to be congruent with the isolation section (15) when viewed in the stacking direction (S).

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First Claim