DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Aug 8, 2024
filing date -
Aug 8, 2024
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Abstract
A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.
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