Importance

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Abstract

A method of cleaning a bottom plate, including: providing an adjacent bottom plate with at least one soldering lug, filling a liquid material between the adjacent bottom plate and the soldering lug to cover the substance to be cleaned, and placing the adjacent bottom plate in a chamber, controlling a temperature of the chamber to 25-200° C., generating oscillating pressure increasing and reducing and/or oscillating vacuum pumping for a gas in the chamber using a pressure increasing and reducing device and/or a vacuum generator, causing a variation of the liquid material using differential pressure variation of the gas, rubbing and scrubbing the liquid material by the differential pressure variation using the differential pressure variation of the gas, and taking the substance to be cleaned attached to the adjacent bottom plate away from the adjacent bottom plate.

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First Claim