Importance

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Abstract

A substrate processing apparatus includes one or more peeling gas nozzles that tears a polymer film by a pressure of a peeling gas such that a peeled portion peeled from an upper surface of a substrate and an adhering portion adhering to the upper surface are included in the polymer film by discharging the peeling gas at a first rate toward the upper surface, and then changes the adhering portion to the peeled portion with the peeling gas that has entered between the peeled portion and the substrate while discharging the peeling gas at a second rate slower than the first rate toward the upper surface, and a nozzle actuator that changes a distance from a hit position of the peeling gas with respect to the upper surface to a center of the substrate by moving the one or more peeling gas nozzles horizontally.

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First Claim