POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE

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United States of America

APP PUB NO 20250051569A1
SERIAL NO

18717683

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Abstract

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A polyamide resin composition according to the present invention is characterized by comprising 100 parts by mass of a polyamide resin (A), 0.005-0.3 parts by mass of a copper compound (B), and 10-250 parts by mass of glass fibers (C), and is characterized in that the percentage content of boron elements in the glass fibers (C) is 1 mass % or less with respect to the total mass of the glass fibers (C).

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Patent Owner(s)

  • ASAHI KASEI KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MIYOSHI, Takaaki Tokyo, JP 36 209
SAKUMA, Teruaki Tokyo, JP 11 29
SHIKANO, Yasukazu Tokyo, JP 15 45

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