PLASMA MODIFICATION OF ADHESIVE AND SUBSTRATE SURFACES FOR USE IN ADHESIVE JOINT APPLICATIONS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250051613A1
SERIAL NO

18797019

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Abstract

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Methods for producing adhesive joints through the application of plasma treatment of both substrates and adhesives are disclosed. The methods involve plasma treating the substrate surfaces to enhance their surface energy and promote better adhesion. The adhesive—whether in the form of an adhesive strip or a flowable adhesive—is also subjected to plasma treatment. This dual treatment results in adhesive joints with enhanced lap shear strength and resistance to debonding. The enhanced performance of the adhesive joints is attributed to the increased intra-molecular bonding at the substrate/adhesive interfaces, enabled by the plasma treatments.

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Patent Owner(s)

Patent OwnerAddress
BATTELLE MEMORIAL INSTITUTEP O BOX 999 DEPT K1-53 RICHLAND WA 99352

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Merkel, Daniel R Richland, US 1 0
Qiao, Yao Richland, US 1 0
Shin, Yongsoon Richland, US 20 408
Simmons, Kevin L Richland, US 22 158

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