PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND BONDED BODY

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United States of America

APP PUB NO 20250051616A1
SERIAL NO

18696743

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Abstract

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An object of the present invention is to provide a pressure-sensitive adhesive composition whose adhesive force is sufficiently reduced by applying a voltage even after storage in a high-temperature and high-humidity environment. The present invention relates to a pressure-sensitive adhesive composition containing a first polymer as a base polymer and an ionic liquid and further containing a second polymer having a glass transition temperature Tg of 40° C. to 180° C.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KURODA, Tomoharu Ibaraki-shi, Osaka, JP 3 0
MIZUHARA, Ginji Ibaraki-shi, Osaka, JP 20 5
TSUMURA, Daisuke Ibaraki-shi, Osaka, JP 10 40

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