ELECTRONIC COMPONENT MOUNTING STRUCTURE AND OUTDOOR UNIT OF AIR CONDITIONER
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Feb 28, 2022
filing date -
Feb 28, 2022
priority date (Note) -
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Abstract
An electronic component mounting structure includes an electronic component, a metal plate having one surface and another surface, and a heat dissipation component having flexibility and elasticity. The heat dissipation component is sandwiched between the one surface of the metal plate and the electronic component with a region of the heat dissipation component that faces the electronic component being deformed along the shape of the electronic component and being in intimate contact with the electronic component, and the heat dissipation component being in intimate contact with the one surface of the metal plate. The electronic component and the metal plate are thermally connected via the heat dissipation component.
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